CAT-R04DOM-02 · Robotics components
Embedded compute
Thermal envelope, software support life, and availability.
Compute modules are selected on benchmarks and regretted on thermals and support life. A module that throttles inside your enclosure delivers a fraction of its benchmark, and one whose BSP is abandoned strands the programme.
Parameter set
01Deciding parameters
The figures that actually decide selection — and why.
Compute
TOPS / GFLOPS
Only comparable at a stated power mode.
Power envelope
W
Determines the thermal solution and the pack budget.
BSP support life
years
Usually the binding constraint on programme life.
Industrial availability
years
Consumer silicon disappears mid-programme.
02Where it is used
Application changes the answer.
- Perception and vision — sustained inference throughput
- Autonomous navigation — deterministic latency
- Edge processing — power budget against capability
- Long-life industrial products — availability guarantees
03Decision drivers
What the choice actually turns on.
- Sustained rather than burst performance in your thermal design
- BSP and kernel support horizon
- Guaranteed availability window
- Toolchain maturity and ecosystem depth
04What we hold
The intelligence behind this category.
Carrier board ecosystem and who actually builds it
Thermal behaviour under sustained load
Support and longevity commitments in writing
Lead-time and allocation history
05What to watch for
Where selection in this category turns.
Sizing on benchmark numbers that assume unthrottled operation
No thermal design until after the enclosure is fixed
Selecting silicon with no availability commitment
Assuming a carrier board is supported as long as the module
Beyond this page
SKU-level intelligence sits behind the requirement.
Validated supplier records, per-SKU parameter data, pricing bands, MOQ patterns, and lead-time history for embedded compute are released against a stated application — because a shortlist is only meaningful once the operating conditions are known.
06Coupled decisions in robotics components
Actuator · drive · encoder · controller share one control loop. Selecting any one of these without the others is the most common source of rework in this domain.
Start with the application
Sourcing embedded compute?
Send the application and the operating conditions. We map the landscape, validate the claims, and return a shortlist with the reason each option is on it.